• Teradyne partnered with Tokyo Electron to launch an integrated test cell for known-good-device screening in AI and data center chips.
• Solution pairs the UltraFLEXplus test platform with Tokyo Electron’s Prexa SDP prober for 2.5D and 3D chiplet packages.
• Aims to cut yield risk in high-value advanced packages where a single defective die can compromise the finished device.
• Targets production use by fabless designers, foundries, and OSATs across multiple points in the advanced packaging flow.
• Commercially available system is built for high-power devices with temperature control to support high-volume manufacturing.

Disclaimer: This news brief was created by Public Technologies (PUBT) using generative artificial intelligence. While PUBT strives to provide accurate and timely information, this AI-generated content is for informational purposes only and should not be interpreted as financial, investment, or legal advice. Teradyne Inc. published the original content used to generate this news brief via Business Wire (Ref. ID: 202606080900BIZWIRE_USPR_____20260608_BW994172) on June 08, 2026, and is solely responsible for the information contained therein.