Resonac inaugurates US-JOINT semiconductor packaging R&D center in Silicon Valley

  • Resonac inaugurated US-JOINT R&D center in Silicon Valley on April 20, 2026, marking full-scale launch of U.S.-Japan advanced semiconductor packaging consortium.
  • Resonac will lead 12-company group to validate next-generation packaging concepts in Union City, California, targeting proof-of-concept timelines as short as one month.


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