• Amkor Technology expanded its Arizona advanced packaging footprint, securing an additional 67-acre parcel next to its 104-acre campus in Peoria’s Innovation Core.
• The added land provides flexibility for future capacity growth as customer demand evolves.
• The Arizona site is positioned as a large-scale advanced semiconductor packaging and test campus, expected to become the first high-volume advanced packaging OSAT facility in the U.S.

Disclaimer: This news brief was created by Public Technologies (PUBT) using generative artificial intelligence. While PUBT strives to provide accurate and timely information, this AI-generated content is for informational purposes only and should not be interpreted as financial, investment, or legal advice. Amkor Technology Inc. published the original content used to generate this news brief via Business Wire (Ref. ID: 20260519425274) on May 20, 2026, and is solely responsible for the information contained therein.