• Applied Materials entered a new innovation partnership with TSMC at Applied’s EPIC Center in Silicon Valley to accelerate development and commercialization of semiconductor technologies aimed at next-generation AI scaling.
• Work will target materials, equipment, and process integration needed for advanced logic nodes, with focus on improving power, performance, area, yield, and reliability as device architectures become more complex and more 3D.
• Partnership is designed to shorten cycle times from research to high-volume manufacturing, giving TSMC earlier access to Applied’s R&D teams and next-generation tools.
• EPIC Center is a planned USD 5 billion investment in advanced semiconductor equipment R&D, expected to scale over time as customer projects commence.

Disclaimer: This news brief was created by Public Technologies (PUBT) using generative artificial intelligence. While PUBT strives to provide accurate and timely information, this AI-generated content is for informational purposes only and should not be interpreted as financial, investment, or legal advice. Applied Materials Inc. published the original content used to generate this news brief via GlobeNewswire (Ref. ID: 202605110900PRIMZONEFULLFEED9717303) on May 11, 2026, and is solely responsible for the information contained therein.