• Applied Materials entered a definitive agreement with ASMPT to acquire its NEXX business, a supplier of panel-level advanced packaging deposition tools.
• Deal adds NEXX’s panel-level electrochemical deposition technology, expanding Applied’s advanced packaging portfolio aimed at larger AI accelerator packages using chiplets and HBM.
• Transaction expected to close within the next several months, subject to customary closing conditions.
• NEXX operations will join Applied’s Semiconductor Products Group and remain based in Billerica, Massachusetts.

Disclaimer: This news brief was created by Public Technologies (PUBT) using generative artificial intelligence. While PUBT strives to provide accurate and timely information, this AI-generated content is for informational purposes only and should not be interpreted as financial, investment, or legal advice. Applied Materials Inc. published the original content used to generate this news brief on May 03, 2026, and is solely responsible for the information contained therein.