** Shares in BE Semiconductor Industries BESI.AS fall 6.5% on media report flagging a potential delay to the adoption of hybrid bonding, one of Besi's key growth drivers

** Korean tech biz news outlet ZDNet reports some industry sources now see the adoption timeline being pushed out further as the existing thermocompression (TC) bonding has been adopted for the high-bandwidth memory (HBM) 4, and hybrid bonding could be used for the 16-layer HBM4E

** For Besi, a slower move to hybrid bonding could weigh on expectations for one of its key growth drivers, where it has a first-mover advantage

** "The news suggests the adoption of hybrid bonding by HBM customers could be potentially delayed further due to height relaxation and net technologies to dissipate heat better than before," says Degroof Petercam analyst Michael Roeg

** Besi shares sit at the bottom of pan-European index STOXX 600 .STOXX