• Cadence entered a multi-year agreement with Samsung Foundry to expand IP and certify AI-optimized design flows on Samsung’s second-generation 2nm node.
• Collaboration targets signoff-ready digital, custom, 3D-IC design, system analysis for AI infrastructure, edge, intelligent-device chips.
• Scope includes broader memory, interface IP portfolios, NVIDIA NVLink-C2C-enabled interconnect, GPU-accelerated EDA libraries for advanced-node implementations.
• Samsung’s 3D Cube-H hybrid copper bonding support added to enable full planning, implementation, signoff for 3D-IC system designs.

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