• Dow will showcase AI thermal management materials at COMPUTEX Taipei 2026 on June 2-5 at the Nangang Exhibition Center (TaiNEX 2).
• Focus on liquid cooling, immersion cooling, thermal interface materials, and advanced semiconductor packaging materials for AI data centers and servers.
• Dow R&D director Myra Zhai will deliver a “Cooling AI-generation data centres” keynote on June 4, 3:30-3:55 p.m., Conference Room 701, TaiNEX 2.

Disclaimer: This news brief was created by Public Technologies (PUBT) using generative artificial intelligence. While PUBT strives to provide accurate and timely information, this AI-generated content is for informational purposes only and should not be interpreted as financial, investment, or legal advice. Dow Inc. published the original content used to generate this news brief on June 02, 2026, and is solely responsible for the information contained therein.