• Enplas will exhibit at COMPUTEX 2026 in Taipei on June 2-5, 2026.
• The company plans to showcase thermal solutions using 3D metal processing technology.
• It will also display glass samples with ultra-fine through-holes produced by laser processing.

Disclaimer: This news brief was created by Public Technologies (PUBT) using generative artificial intelligence. While PUBT strives to provide accurate and timely information, this AI-generated content is for informational purposes only and should not be interpreted as financial, investment, or legal advice. Enplas Corporation published the original content used to generate this news brief on May 25, 2026, and is solely responsible for the information contained therein.