• Qnity will showcase new organic interposer packaging materials at JPCA Show 2026 in Tokyo on June 10-12.
• Event focus includes advanced interconnect formation for AI and high-performance computing packaging, including redistribution layer designs.
• Products will be featured at booth #2C-47 at Tokyo Big Sight.

Disclaimer: This news brief was created by Public Technologies (PUBT) using generative artificial intelligence. While PUBT strives to provide accurate and timely information, this AI-generated content is for informational purposes only and should not be interpreted as financial, investment, or legal advice. Qnity Electronics Inc. published the original content used to generate this news brief on June 09, 2026, and is solely responsible for the information contained therein.