Qualcomm Inc. and Hyundai Mobis have signed a comprehensive agreement to collaborate on software-defined vehicle (SDV) architecture for advanced driver assistance systems (ADAS). Announced at CES 2026, the partnership aims to co-develop integrated automotive solutions tailored for emerging markets, leveraging Hyundai Mobis's system integration and sensor fusion expertise alongside Qualcomm Technologies' leadership in system-on-chip (SoC) technology. The companies plan to enhance ADAS performance using the Snapdragon Ride Flex SoC and expand their collaboration to deliver broader SDV solutions based on Snapdragon automotive technologies.

Disclaimer: This news brief was created by Public Technologies (PUBT) using generative artificial intelligence. While PUBT strives to provide accurate and timely information, this AI-generated content is for informational purposes only and should not be interpreted as financial, investment, or legal advice. Qualcomm Inc. published the original content used to generate this news brief on January 07, 2026, and is solely responsible for the information contained therein.