ACM Research Receives Multiple Advanced Packaging Equipment Orders From Global Semiconductor And Technology Customers

ACM Research, Inc. Class A +0.20%

ACM Research, Inc. Class A

ACMR

40.54

+0.20%

-Expands Advanced Packaging Platform Across Wafer-Level and Panel-Level Applications in Key Global Markets-

FREMONT, Calif., Feb. 26, 2026 (GLOBE NEWSWIRE) -- ACM Research, Inc. ("ACM") (NASDAQ:ACMR), a leading supplier of wafer and panel processing solutions for semiconductor and advanced packaging applications, today announced it has received multiple advanced packaging equipment orders from leading global semiconductor and technology customers.

This includes orders for:

  • Multiple wafer-level advanced packaging systems from a leading global OSAT customer based in Singapore, with deliveries scheduled for the first quarter of 2026;
  • A panel-level advanced packaging vacuum cleaning tool from a leading global semiconductor packaging manufacturer based outside mainland China, also scheduled for delivery in the first quarter of 2026; and
  • Multiple wafer-level advanced packaging systems from a leading North America-based technology customer, with deliveries scheduled for later this year.

These recent customer wins represent a meaningful step forward in ACM's continued expansion of its advanced packaging platform and global customer base, reflecting growing industry recognition of ACM's differentiated technology portfolio across both wafer-level and panel-level applications.