AMD invests over $10 billion in Taiwan ecosystem to scale AI packaging capacity

Advanced Micro Devices, Inc.

Advanced Micro Devices, Inc.

AMD

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  • AMD outlined more than $10 billion of investments across Taiwan to expand strategic partnerships, scale advanced packaging capacity, ramp AI infrastructure manufacturing.
  • Spending targets wafer-based 2.5D bridge interconnect technology, including EFB packaging intended to lift interconnect bandwidth, improve power efficiency for 6th Gen EPYC “Venice” CPUs.
  • Qualified a 2.5D panel-based EFB interconnect with PTI, aiming to improve scale economics for high-volume deployment.
  • Helios rack-scale platform pairing “Venice” CPUs with Instinct MI450X GPUs remains on track for multi-gigawatt deployments starting in 2H 2026, supported by ODM manufacturing partners.


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