Applied Materials buys 9% stake in advanced packaging firm BESI

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April 15 (Reuters) - Applied Materials AMAT.O has bought a 9% stake in BE Semiconductor industries (BESI) BESI.AS, the U.S.-based computer chip equipment supplier said on Monday.

The Dutch semiconductor advanced packaging firm produces the world's most accurate hybrid bonding tool, a critical chip technology allowing two chips to be bonded directly on top of each other.

Applied Materials said it did not intend to seek board representation at BESI.


(Reporting by Nathan Vifflin, editing by Milla Nissi)

((nathan.vifflin@thomsonreuters.com; +48 58 769 67 13;))

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