BUZZ-BESI falls after media report says rules for HBM chip thickness may be loosened
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** Shares in BE Semiconductor Industries (Besi) BESI.AS fall 8.7% after ZDNet Korea reported that JEDEC, the industry group that sets chip standards, was discussing less strict thickness rules for next-generation high-bandwidth memory (HBM) chips
** HBM chips are the main type of memory chips used in AI accelerators
** The Besi shares are on track for their largest single-day fall since October 2024 if the losses hold
** According to the media report, JEDEC participants are discussing thickness standards of 825-900 micrometers or more for next-generation HBM products beyond HBM4, compared with 775 micrometers for HBM4
** "This could potentially reduce demand for hybrid bonding, which is a technology that can result in less HBM high stacks," analyst Trion Reid from Berenberg said in an email
** Major HBM chipmakers include Samsung Electronics 005930.KS, SK Hynix 000660.KS and Micron MU.O, serving clients such as Nvidia NVDA.O
** HBM chips are currently made mainly using thermal compression bonding, while BESI investors are betting on future adoption of the company's hybrid bonding technology