Infineon to showcase EasyPACK S power module concept at PCIM Europe 2026

Zimmer Biomet Holdings, Inc.

Zimmer Biomet Holdings, Inc.

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  • Infineon will present its EasyPACK S power module and package concept at PCIM Europe 2026 in Nuremberg on June 9-11, 2026.
  • The new module targets higher power density in space-constrained applications, including EV on-board chargers and power supplies for AI data centers.
  • Initial EasyPACK S modules integrate 1,200 V CoolSiC MOSFETs G2, IGBT4, and IGBT7 technologies.


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