• Keysight Technologies partnered with WIN Semiconductors to launch a joint GaN MMIC design workflow aimed at improving first-pass tapeout success.
• The combined flow links on-chip simulation, 3D layout verification, and evaluation-board design to reduce foundry respin risk for high-frequency RF components.
• WIN’s NP 120P GaN process design kit integrates with Keysight ADS and RF Circuit Simulation Professional to automate design sign-off steps.
• The collaboration targets demand from 5G, satellite, and defense programs where buyers require measured performance on physical evaluation boards before committing.

Disclaimer: This news brief was created by Public Technologies (PUBT) using generative artificial intelligence. While PUBT strives to provide accurate and timely information, this AI-generated content is for informational purposes only and should not be interpreted as financial, investment, or legal advice. Keysight Technologies Inc. published the original content used to generate this news brief via Business Wire (Ref. ID: 202606301100BIZWIRE_USPR_____20260630_BW264913) on June 30, 2026, and is solely responsible for the information contained therein.