• Lam Research opened a panel-level packaging Center of Excellence in Salzburg, Austria, expanding its investment in advanced packaging for AI-driven demand.
• The new processing lab targets faster panel-level R&D, customer co-development, early qualification, scaling, as the industry evaluates a shift from wafer to panel formats.
• The site extends capabilities added through Lam’s 2022 acquisition of Semsysco in Salzburg, strengthening its European R&D footprint.
• Salzburg becomes Lam’s first panel-focused wet-processing R&D site, specializing in wet-chemical processing for square and rectangular substrates.
• Work will support Lam’s Kallisto and Phoenix platforms used for deposition, etch, cleaning processes aimed at manufacturability and throughput.

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