MOVES-MediaTek hires former TSMC executive to boost AI chip packaging

NVIDIA Corporation

NVIDIA Corporation

NVDA

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By Wen-Yee Lee

- Taiwanese chip designer MediaTek 2454.TW said it has appointed former TSMC 2330.TW executive Douglas Yu as a part-time adviser as it steps up advanced packaging work and expands into the AI chip market.


Here are a few details:

  • Yu joined TSMC in 1994 and retired in 2025, holding a range of roles in backend research and development. He played a key part in developing TSMC's advanced packaging technologies, including its CoWoS (Chip on Wafer on Substrate).

  • CoWoS is a key chip packaging technology widely used in artificial intelligence chips, including Nvidia NVDA.O chips.

  • "We look forward to leveraging his extensive industry experience and technical expertise to support the company's exploration and roadmap planning for future advanced packaging technologies, as well as to guide our R&D and investment strategy in advanced packaging-related products and technologies associated with TSMC," MediaTek said in a statement on Saturday.

  • TSMC's CoWoS capacity has been in high demand, with customers such as Nvidia and cloud service providers scrambling to secure capacity.

  • Last week, MediaTek said it expects to generate multiple billions of dollars in revenue from its AI accelerator ASIC chips by 2027.