Resideo Funding II joins Resideo credit agreement as borrower, grants collateral to JPMorgan-led lenders
Resideo Technologies, Inc. REZI | 0.00 |
- Resideo Funding II assumed Resideo Funding’s borrower obligations under a second amended and restated credit agreement dated June 4, 2026.
- The shift followed a June 24, 2026 merger that made Resideo Funding II the surviving entity.
- JPMorgan Chase Bank serves as administrative agent for the lender group under the credit agreement.
- Resideo Funding II granted a security interest over substantially all assets to support the facility.
- It also agreed to guarantee certain obligations of the company and its subsidiaries under the credit agreement.
Disclaimer: This news brief was created by Public Technologies (PUBT) using generative artificial intelligence. While PUBT strives to provide accurate and timely information, this AI-generated content is for informational purposes only and should not be interpreted as financial, investment, or legal advice. Resideo Technologies Inc. published the original content used to generate this news brief via EDGAR, the Electronic Data Gathering, Analysis, and Retrieval system operated by the U.S. Securities and Exchange Commission (Ref. ID: 0001213900-26-071530), on June 24, 2026, and is solely responsible for the information contained therein.
