Schneider Electric, AMD release Helios AI rackscale reference design for high-density data centers

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  • Schneider Electric entered a collaboration with AMD to co-develop a validated reference design for AMD’s Helios rackscale AI platform.
  • Reference design targets faster rollout of high-density AI “factory” data centers, aiming to cut integration risk across power, cooling, IT layout.
  • Blueprint supports racks up to 246 kW, modular AI clusters up to 10.4 MW IT load, aiming for PUE near 1.12 at full load.
  • Design centers on liquid cooling, using CDU-based systems, targeting removal of up to 84% of heat from high-density AI deployments.
  • Initial framework validated to US ANSI standards, with plans to extend to IEC standards for broader global deployment.


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