SemiLEDs Has Received A Notice Of Allowance For A U.S. Patent Titled "Method To Remove An Isolation Layer On The Corner Between The Semiconductor Light Emitting Device To The Growth Substrate".

SemiLEDs Corporation

SemiLEDs Corporation

LEDS

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https://patentcenter.uspto.gov/applications/17673234/ifw/docs

https://x.com/PatentGrants/status/2064436398774747394

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