T. Rowe Price CIO Veiel interviews Intel CEO Tan on AI infrastructure demand, turnaround strategy
T. Rowe Price Group, Inc.
Intel Corporation
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- T. Rowe Price management interviewed Intel CEO Lip-Bu Tan on “The Angle,” focusing on Intel’s turnaround and AI-driven shifts in semiconductor demand.
- Discussion centered on rising AI infrastructure needs, highlighting the growing importance of CPUs, GPUs, advanced packaging, supply chains, and foundry capabilities.
- Tan outlined priorities to restore execution and customer trust, build accountable teams, accelerate decision-making, and respond faster to changing workloads.
- Episode released June 17, 2026 as part of the firm’s C-suite podcast series launched in 2024.
Disclaimer: This news brief was created by Public Technologies (PUBT) using generative artificial intelligence. While PUBT strives to provide accurate and timely information, this AI-generated content is for informational purposes only and should not be interpreted as financial, investment, or legal advice. T. Rowe Price Group Inc. published the original content used to generate this news brief via PR Newswire (Ref. ID: 202606170930PR_NEWS_USPR_____PH85440) on June 17, 2026, and is solely responsible for the information contained therein.
