Applied Materials partners with Broadcom on advanced AI chip packaging R&D

Applied Materials
Broadcom Limited

Applied Materials

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Broadcom Limited

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  • Applied Materials added Broadcom as an innovation partner in its EPIC platform to speed development of advanced chip packaging for next-generation AI systems.
  • The companies plan joint R&D focused on advanced packaging and higher-density interconnects to improve performance-per-watt and shorten time to market for new AI chips and systems.
  • Broadcom will use Applied’s global network of innovation centers, including the new EPIC Center in Silicon Valley that is expected to become operational in 2026.


Disclaimer: This news brief was created by Public Technologies (PUBT) using generative artificial intelligence. While PUBT strives to provide accurate and timely information, this AI-generated content is for informational purposes only and should not be interpreted as financial, investment, or legal advice. Applied Materials Inc. published the original content used to generate this news brief via GlobeNewswire (Ref. ID: 202605200800PRIMZONEFULLFEED9723111) on May 20, 2026, and is solely responsible for the information contained therein.

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